For low-volume production or prototypes of custom server racks, control panels, and NEMA enclosures, we recommend Sheet Metal Fabrication (Laser/Turret/Brake), as it requires no hard tooling. For high-volume components like internal PCB mounting brackets, connector clips, and heat sinks, Progressive Die Stamping is the most cost-effective method, offering the lowest piece-price and strict part-to-part consistency for automated assembly.

Precision is critical for electronics integration. We maintain strict dimensional tolerances (typically ±0.005″ for feature locations) to ensure perfect alignment between your metal chassis and the Printed Circuit Board (PCB) mounting holes, standoffs, and I/O connectors. This eliminates assembly line failures and ensures your device fits together seamlessly every time.

Yes. We specialize in stamping and forming high-conductivity components such as copper busbars, battery contacts, and grounding clips. We work with specific electronic alloys including Beryllium Copper (BeCu), Phosphor Bronze, and Brass to ensure optimal spring retention and conductivity. We can also provide silver or tin plating to prevent oxidation and improve solderability.

We understand that speed is critical in electronics development. We utilize Laser Cutting and Turret Punching to produce functional prototypes of chassis and brackets in as little as 2-4 weeks. This allows you to perform physical fit-checks with your electronic components and validate the design immediately, while permanent production tooling is being built.

Yes. We offer complete turnkey assembly services for electronic components. We handle secondary operations such as hardware insertion (PEM nuts/standoffs) for PCB mounting, as well as plating (tin, silver, gold) and powder coating to ensure your parts are conductive, corrosion-resistant, and ready for final assembly.